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Tender NoticeTin

Scrap Materials - Substrate Molding Resin, Tin Balls, Steel Packaging Materials, etc.

By:
Payton Technology (Shenzhen) Co., Ltd.
Region:
Futian District, Shenzhen, Guangdong
Published:
2026-08-25
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Notice Details

[Tender Notice] Scrap Materials - Substrate Molding Resin, Tin Balls, Steel Packaging Materials, etc. Purchasing Unit: Payton Technology (Shenzhen) Co., Ltd. Region: Futian District, Shenzhen, Guangdong Industry: Energy & Chemicals Project No.: TJ2026BJ1034829 Published: 2026-08-26 Original Notice: https://otc.cbex.com/xmjs/prj/detail/207168.html