Tender NoticeTin
Guangzhou Guangxin Packaging Substrate Co., Ltd. Project - Automatic Solder Ball Inspection Machine - International Tender Announcement
- By:
- Guangzhou Guangxin Packaging Substrate Co., Ltd.
- Region:
- Huangpu District, Guangzhou, Guangdong
- Published:
- 2026-07-16
- Deadline:
- 2026-08-06
- Contact
Notice Details
[Tender Notice] Guangzhou Guangxin Packaging Substrate Co., Ltd. Project - Automatic Solder Ball Inspection Machine - International Tender Announcement
Purchasing Unit: Guangzhou Guangxin Packaging Substrate Co., Ltd.
Agency: 中航招采科技(北京)有限公司
Region: Huangpu District, Guangzhou, Guangdong
Project No.: 0730-264010SZ0103/09
Published: 2026-07-17
Document Deadline: 2026-07-24
Bid Deadline: 2026-08-07
Bid Opening: 2026-08-07