Tender NoticeSemiconductor
Germany – Microelectronic machinery and apparatus – 300 mm D2W hybrid bonding tool (IZM-131.1) - PR1254078-3460-P
- By:
- Fraunhofer-Gesellschaft - Einkauf B12
- Region:
- Germany · München
- Published:
- 2026-08-02
- Contact
Notice Details
[TED 534141-2026] Germany – Microelectronic machinery and apparatus – 300 mm D2W hybrid bonding tool (IZM-131.1) - PR1254078-3460-P Buyer: Fraunhofer-Gesellschaft - Einkauf B12 CPV: 31712100, 31712100 300 mm D2W hybrid bonding tool (IZM-131.1)